JPS6231818B2 - - Google Patents

Info

Publication number
JPS6231818B2
JPS6231818B2 JP56000041A JP4181A JPS6231818B2 JP S6231818 B2 JPS6231818 B2 JP S6231818B2 JP 56000041 A JP56000041 A JP 56000041A JP 4181 A JP4181 A JP 4181A JP S6231818 B2 JPS6231818 B2 JP S6231818B2
Authority
JP
Japan
Prior art keywords
lead
bonding
lead frame
post
television
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56000041A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57113240A (en
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56000041A priority Critical patent/JPS57113240A/ja
Publication of JPS57113240A publication Critical patent/JPS57113240A/ja
Publication of JPS6231818B2 publication Critical patent/JPS6231818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56000041A 1981-01-05 1981-01-05 Wire bonding apparatus Granted JPS57113240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000041A JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000041A JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
JPS57113240A JPS57113240A (en) 1982-07-14
JPS6231818B2 true JPS6231818B2 (en]) 1987-07-10

Family

ID=11463220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000041A Granted JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS57113240A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455079U (en]) * 1990-09-17 1992-05-12

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5647697B2 (en]) * 1973-06-26 1981-11-11
JPS5080763A (en]) * 1973-11-14 1975-07-01
JPS5160410A (ja) * 1974-11-25 1976-05-26 Hitachi Ltd Kotonaruichinisonzaisurufukusuno zahyono gentenitsuchiho
JPS542069B2 (en]) * 1974-12-25 1979-02-01
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455079U (en]) * 1990-09-17 1992-05-12

Also Published As

Publication number Publication date
JPS57113240A (en) 1982-07-14

Similar Documents

Publication Publication Date Title
US5238174A (en) Smart indexing head for universal lead frame work station
EP0660657A1 (en) Method and mounting device for mounting a component at a specific position
US6898848B2 (en) Method of bonding inner leads to chip pads
US10674650B2 (en) Component mounting device
JP2009094283A (ja) 実装基板の生産方法、表面実装機及び実装基板生産管理装置
JP3275744B2 (ja) ワークの熱圧着装置
JP3069252B2 (ja) 端子挿入装置及びこれに用いる端子挿入機構
JP3790020B2 (ja) 表面実装機
US20180263150A1 (en) Component mounting device
JPS6231818B2 (en])
JP4607679B2 (ja) 電子部品実装装置における吸着ノズルの部品吸着位置確認方法および電子部品実装装置
JP2774587B2 (ja) Ｔａｂ部品の実装装置における教示方法
JP6059813B2 (ja) 部品実装装置、その制御方法および部品実装装置用プログラム
JP2917826B2 (ja) 電子部品の実装方法及び実装装置
JP2526551B2 (ja) Ｉｃの挿入装置
KR100368626B1 (ko) 와이어본딩방법 및 장치
JP2832744B2 (ja) インナーリードボンディング方法
JP3138099B2 (ja) 部品装着装置
JPS6120345A (ja) ボンディング方法およびボンディング装置
JP2511568B2 (ja) チップマウンタ
JPH0141026B2 (en])
JPH08293700A (ja) 実装機の位置補正方法及びその装置
JPS6027200A (ja) 電子部品実装時の自動座標修正装置
JPH0527978B2 (en])
JP3128401B2 (ja) 部品装着装置